Preface.
Symbols.
Physics of Failure In Electronic Systems.
Thermal Expansion Displacements, Forces, and Stresses.
Vibration of Beams and Other Simple Structures.
Vibration of Printed Circuit Boards and Flat Plates.
Estimating Fatigue Life in Thermal Cycling and
VibrationEnvironments.
Octave Rule, Snubbers, Dampers, and Isolation for
PreventingVibration Damage to Electronic Systems.
Displacements, Forces, and Stresses in Axial Leaded ComponentWires
Due to Thermal Expansions.
Designing Electronic Equipment for Sinusoidal Vibration.
Assessment of Random Vibration on Electronic Design.
Combining Fatigue Damage for Random Vibration and Thermal
Cycling.
Thermal Cycling Failures in Surface-Mounted Components.
Stresses and Fatigue Life in Component Lead Wires and SolderJoints
Due to Dynamic Forces and PCB Displacements.
Fatigue Life of Long Components, Tall Components, and
SmallComponents Mounted on PCBs.
Wear and Interface Surface Fretting Corrosion in
ElectricalConnectors.
Case Histories of Failures and Failure Analyses.
Bibliography.
Index.
Dave S. Steinberg is the author of Preventing Thermal Cycling and Vibration Failures in Electronic Equipment, published by Wiley.
"...text s purpose is to show manufacturers how to design, analyze, and evaluate electronic systems for lower cost and improved reliability in harsh environments..." (SciTech Book News, Vol. 25, No. 4, December 2001)
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